Prof. Lei ShuCollege of Engineering, Nanjing Agricultural University, China
Biography: Lei Shu (Senior Member, IEEE) received the B.S. degree in computer science from South Central University for Nationalities, China, in 2002, the M.S. degree in computer engineering from Kyung Hee University, South Korea, in 2005, and the Ph.D. degree from the Digital Enterprise Research Institute, National University of Ireland, Galway, Ireland, in 2010. Until 2012, he was a Specially Assigned Researcher with the Department of Multimedia Engineering, Graduate School of Information Science and Technology, Osaka University, Japan. He is currently a Distinguished Professor with Nanjing Agricultural University, China, and a Lincoln Professor with the University of Lincoln, U.K. He is also the Director of the NAU-Lincoln Joint Research Center of Intelligent Engineering. He has published more than 400 articles in related conferences, journals, and books in the areas of sensor networks and Internet of Things. His current H-index is 60 and i10-index is 197 in Google Scholar Citation. His current research interests include wireless sensor networks and the Internet of Things. He has also served as a TPC member for more than 150 conferences, such as ICDCS, DCOSS, MASS, ICC, GLOBECOM, ICCCN, WCNC, and ISCC. He was a recipient of the 2014 Top Level Talents in Sailing Plan of Guangdong Province, China, the 2015 Outstanding Young Professor of Guangdong Province, and the GLOBECOM 2010, ICC 2013, ComManTel 2014, WICON 2016, SigTelCom 2017 Best Paper Awards, the 2017 and 2018 IEEE Systems Journal Best Paper Awards, the 2017 Journal of Network and Computer Applications Best Research Paper Award, and the Outstanding Associate Editor Award of 2017, and the 2018 IEEE Access. He has also served more than 50 various Co-Chair for international conferences/workshops, such as IWCMC, ICC, ISCC, ICNC, Chinacom, especially the Symposium Co-Chair for IWCMC 2012, ICC 2012, the General Co-Chair for Chinacom 2014, Qshine 2015, Collaboratecom 2017, DependSys 2018, and SCI 2019, the TPC Chair for InisCom 2015, NCCA 2015, WICON 2016, NCCA 2016, Chinacom 2017, InisCom 2017, WMNC 2017, and NCCA 2018.